Air cooling characteristics of a uniform square modules array for electronic device heat sink

Author:

Mohamed Mousa M.

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Energy Engineering and Power Technology

Reference18 articles.

1. Optimal placement of heat sources on a rectangular grid;Cahlon;Mathematics and Computers in Simulation,1992

2. Air cooling of front-end electronics for silicon detectors in a collider experiment;Lock;Nuclear Instruments and methods in Physics Research A,1994

3. M.L. Buller, R.F. Kilburn, Calculation of surface heat transfer coefficients for electronic module packages, in: Heat Transfer in Electronic Equipment, HTD, ASME, Winter Annual Meeting, November 20 (1981) 15–29.

4. Convective heat transfer response to height differences in an array of block-like electronic components;Sparrow;Journal of Heat Mass Transfer,1984

5. Convective heat transfer and pressure drop characteristics of various array configurations to simulate the cooling of electronics modules;Jubran;International Journal of Heat Mass Transfer,1996

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