Author:
Huang Shanbo,Zhao Jin,Gong Liang,Duan Xinyue
Funder
National Natural Science Foundation of China
Fundamental Research Funds for the Central Universities
Subject
Industrial and Manufacturing Engineering,Energy Engineering and Power Technology
Reference22 articles.
1. S.G. Yao, Z.S. Ma, L. Luo, R.B. Chen, Improvement of Heat Pipe Technique for High Heat Flux Electronics Cooling, Dept. of Mechanical Eng. East China Shipbuiding Institute, Zhenjiang, Jiangsu 212003, China, vol. 04, 2003, pp. 1006–1008.
2. High-performance heat sinking for VLSI;Tuckerman;IEEE Electron Device Lett.,1981
3. Three-dimensional conjugate heat transfer in the microchannel heat sink for electronic packaging;Fedorov;Int. J. Heat Mass Transf.,2000
4. Experimental and numerical study of pressure drop and heat transfer in a single-phase micro-channel heat sink;Qu;Int. J. Heat Mass Transf.,2002
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