Optimization of microchannel heat sink based on multi-objective particle swarm optimization algorithm for integrated circuit chips cooling
Author:
Affiliation:
1. School of Physics and Telecommunications Engineering, South China Normal University, Guangzhou, China
2. School of Information Engineering, Guangzhou City Polytechnic, Guangzhou, China
Funder
Guangzhou Science and Technology Project
Guangdong Provincial Natural Science Foundation of China
Guangdong Provincial College Youth Innovation Talent Project
University Scientific research Project of Guangzhou Education Bureau
Publisher
Informa UK Limited
Subject
Computer Science Applications,Mechanics of Materials,Condensed Matter Physics,Modeling and Simulation,Numerical Analysis
Link
https://www.tandfonline.com/doi/pdf/10.1080/10407790.2023.2296620
Reference41 articles.
1. Ultrafast and energy-efficient all-optical switching with graphene-loaded deep-subwavelength plasmonic waveguides
2. Heat Transfer in Microchannels—2012 Status and Research Needs
3. Cramming More Components Onto Integrated Circuits
4. Investigation on the performance prediction of microchannel heat sink based on machine learning approach;Yang M.;J. Eng. Thermophys. Russ.,2023
5. Heat transfer optimization based on finned microchannel heat sink
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