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Fabrication and performance evaluation of flexible heat pipes for potential thermal control of foldable electronics

  • Published:2016-02 Issue: Volume:95 Page:445-453
  • ISSN:1359-4311
  • Container-title:Applied Thermal Engineering
  • language:en
  • Short-container-title:Applied Thermal Engineering

Author:

Yang Chao,Chang Chao,Song Chengyi,Shang Wen,Wu Jianbo,Tao Peng,Deng Tao

Funder

Natural Science Foundation of China

Natural Science Foundation of Shanghai

Starting Foundation for New Teacher of Shanghai Jiao Tong University

Zhi-Yuan Endowed fund

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Energy Engineering and Power Technology

Reference36 articles.

1. Review of heat transfer technologies in electronic equipment;Yeh;J. Electron. Packag,1995

2. Review and advances in heat pipe science and technology;Faghri;J. Heat Transf,2012

3. An Introduction to Heat Pipes: Modeling, Testing, and Applications;Peterson,1994

4. Heat pipe cooling technology for desktop PC CPU;Kim;Appl. Therm. Eng,2003

5. A review of the applications of heat pipe heat exchangers for heat recovery;Srimuang;Renew. Sust. Energy Rev,2012

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