Performance tests on a novel vapor chamber

Author:

Wong Shwin-Chung,Huang Siao-Fang,Hsieh Kuo-Chun

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Energy Engineering and Power Technology

Reference18 articles.

1. M. Mochizuki, Y. Saito, F. Kiyooka, T. Nguyen, The way we were and are going on cooling high power processors in the industries, in: The Seventh International Symposium in Transport Phenomena, September 4–8, 2006, Toyama, Japan.

2. Quantitative thermal performance evaluation of a cost-effective vapor chamber heat sink containing a metal-etched microwick structure for advanced microprocessor cooling;Go;Sens. Actuators A,2005

3. Nucleate boiling in a flat grooved heat pipe;Lips;Int. J. Therm. Sci.,2008

4. Metallic micro heat pipe heat spreader fabrication;Kang;Appl. Therm. Eng.,2004

5. Wickless network heat pipes for high heat flux spreading applications;Cao;Int. J. Heat Mass Transfer,2002

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