Author:
Wang Xiang,Castellazzi Alberto,Zanchetta Pericle
Subject
Industrial and Manufacturing Engineering,Energy Engineering and Power Technology
Reference22 articles.
1. Thermal stress related packaging failure in power IGBT modules;Wu,1995
2. Selected failure mechanisms of modern power modules;Ciappa;Microelectron. Reliab.,2002
3. Replacement policies for a unit with random and wearout failures;Nakagawa;IEEE Trans. Reliab.,1980
4. Random failure;Badenius;IEEE Trans. Reliab.,1970
5. Compact modeling of MOSFET wearout mechanisms for circuit-reliability simulation;Li;IEEE Trans. Device Mater. Reliab.,2008
Cited by
19 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献