Optimized distribution of a large number of power electronics components cooled by conjugate turbulent natural convection
Author:
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Energy Engineering and Power Technology
Reference39 articles.
1. A review on natural convection in enclosures for engineering applications. the particular case of the parallelogrammic diode cavity;Baïri;Appl. Therm. Eng.,2014
2. Heat and Mass Transfer: Fundamentals and Applications;Cengel,2015
3. Transitional natural convection flow and heat transfer in an open channel;Sanvicente;Int. J. Therm. Sci.,2013
4. Thermal rating of a submerged substation for wave power;Baudoin;IEEE Trans. Sustain. Energy,2016
5. Cooling of server electronics: a design review of existing technology;Kheirabadi;Appl. Therm. Eng.,2016
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