Thermoelectric hotspot cooling using thermally conductive fillers
Author:
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Energy Engineering and Power Technology,Fluid Flow and Transfer Processes,Mechanical Engineering
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Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. New Directions for Thermoelectrics: A Roadmap from High‐Throughput Materials Discovery to Advanced Device Manufacturing;Small Science;2024-04-04
2. A review: From the whole process of making thermal conductive polymer, the effective method of improving thermal conductivity;Journal of Polymer Science;2024-03-13
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