Improving aging performance of electrodeposited copper coatings during pool boiling-Reference-Cited by-同舟云学术

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Improving aging performance of electrodeposited copper coatings during pool boiling

Published:2018-07 Issue: Volume:140 Page:406-414
ISSN:1359-4311
Container-title:Applied Thermal Engineering
language:en
Short-container-title:Applied Thermal Engineering

Author:

Rishi Aniket M.,Gupta Anju,Kandlikar Satish G.

Funder

National Science Foundation

Division of Chemical, Bioengineering, Environmental, and Transport Systems

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Energy Engineering and Power Technology

Reference40 articles.

1. Pool boiling heat transfer and bubble dynamics over plain and enhanced microchannels;Cooke;J. Heat Transf.,2011

2. Effect of open microchannel geometry on pool boiling enhancement;Cooke;Int. J. Heat Mass Transf.,2012

3. Optimization of enhanced surfaces for high flux chip cooling by pool boiling;Mudawar;J. Electron. Packag.,1993

4. A new microstructure for pool boiling;Mitrovic;Superlattices Microstruct.,2004

5. Enhanced boiling heat transfer from electronic components by use of surface microstructures;Honda;Exp. Therm. Fluid Sci.,2004

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