Open package form-stable phase change microspheres with low thermal contact resistance for the thermal management of electronic devices-Reference-Cited by-同舟云学术

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Open package form-stable phase change microspheres with low thermal contact resistance for the thermal management of electronic devices

Published:2024-03 Issue: Volume:241 Page:122396
ISSN:1359-4311
Container-title:Applied Thermal Engineering
language:en
Short-container-title:Applied Thermal Engineering

Author:

Liu Changqing,Yu Wei^ORCID,Fan Junhui,Li Yifan,Chen Jin,Fu Jun,Peng Guilong,Liu Jianying

Publisher

Elsevier BV

Reference26 articles.

1. Joint-inspired liquid and thermal conductive interface for designing thermal interface materials with high solid filling yet excellent thixotropy;Xie;Adv. Funct. Mater.,2023

2. Shichen Xu, et al., Chloroform-assisted rapid growth of vertical graphene array and its application in thermal interface materials, Adv. Sci.9 (15) (2022): 2200737.

3. Phase change mediated graphene hydrogel-based thermal interface material with low thermal contact resistance for thermal management;Yang;Compos. Sci. Technol.,2022

4. Fundamental and estimation of thermal contact resistance between polymer matrix composites: A review;Zhou;Int. J. Heat Mass Transf.,2022

5. Temperature-dependent adhesive polymer-based composites with shape adaptability and low thermal contact resistance for thermal management;Lei;Mater. Today Commun.,2023

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Flexible and recyclable thermally conductive phase change composites with shape stability;Journal of Applied Polymer Science;2024-07-03

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