Thermal placement optimization of multichip modules using a sequential metamodeling-based optimization approach
Author:
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Energy Engineering and Power Technology
Reference25 articles.
1. Mechanically floating multi-chip substrate;Brzezinski;Applied Thermal Engineering,1997
2. On the thermal performance characteristics of 3D multichip modules;Chen;ASME Transactions, Journal of Electronic Packaging,2004
3. Integration of simulation and response surface methods for thermal design of multichip modules;Cheng;IEEE Transactions on Components and Packaging Technologies,2004
4. A force-directed based optimization scheme for thermal placement design of MCMs;Cheng;IEEE Transactions on Advanced Packaging,2007
5. Theoretical and experimental characterization of heat dissipation in a board-level microelectronic component;Cheng;Applied Thermal Engineering,2008
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