An immersed jet array impingement cooling device with distributed returns for direct body liquid cooling of high power electronics-Reference-Cited by-同舟云学术

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An immersed jet array impingement cooling device with distributed returns for direct body liquid cooling of high power electronics

Published:2019-11 Issue: Volume:162 Page:114259
ISSN:1359-4311
Container-title:Applied Thermal Engineering
language:en
Short-container-title:Applied Thermal Engineering

Author:

Wu Ruikang,Fan Yiwen,Hong Tao,Zou Hao,Hu Run,Luo Xiaobing^ORCID

Funder

National Natural Science Foundation of China

Ministry of Science and Technology of the People’s Republic of China

Creative Research Groups Funding of Hubei Province

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Energy Engineering and Power Technology

Reference38 articles.

1. Thermal management on IGBT power electronic devices and modules;Qian;IEEE Access,2018

2. Heat and fluid flow in high-power LED packaging and applications;Luo;Prog. Energ. Combust. Sci.,2016

3. Review of cooling technologies for computer products;Chu;IEEE Trans. Dev. Mater. Res.,2004

4. A critical review of traditional and emerging techniques and fluids for electronics cooling;SOhel Murshed;Renew. Sust. Energy Rev.,2017

5. Heat management in power converters: from state of the art to future ultrahigh efficiency systems;Laloya;IEEE Trans. Power Electr.,2016

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