A CFD analysis of an electronics cooling enclosure for application in telecommunication systems

Author:

Boukhanouf R.,Haddad A.

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Energy Engineering and Power Technology

Reference17 articles.

1. Heat Pipes: Theory, Design and Applications;Reay,2006

2. Application of refrigeration system in electronics cooling;Agwu Nnanna;Applied Thermal Engineering,2006

3. Package embedded heat exchanger for stacked multi-chip module;Lee;Sensors and Actuators A,2004

4. Computer and telecommunications equipment room cooling; a review of literature;Schmidt;IEEE Transactions on Components and Packaging Technologies,2003

5. Horizontal simulated printed-circuit board assembly in fully-developed laminar-flow convection;Leung;Applied Energy,1997

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