Effect of phase change material in cross flow and jet impingement cooling techniques used in heat sink for electronics application-Reference-Cited by-同舟云学术

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Effect of phase change material in cross flow and jet impingement cooling techniques used in heat sink for electronics application

Published:2024-04-22 Issue: Volume: Page:1-23
ISSN:1040-7782
Container-title:Numerical Heat Transfer, Part A: Applications
language:en
Short-container-title:Numerical Heat Transfer, Part A: Applications

Author:

Parthipan Deerajkumar¹,Dharmalingam Babu²,Sankaran Somasundharam³,Rajagopal Deepakkumar¹^ORCID

Affiliation:

1. Department of Thermal and Energy Engineering, School of Mechanical Engineering, Vellore Institute of Technology, India

2. Department of Mechanical Engineering, College of Engineering, Guindy (CEG), Anna University, Chennai, India

3. Institute for Energy Studies, College of Engineering, Guindy (CEG), Anna University, Chennai, India

Publisher

Informa UK Limited

Link

https://www.tandfonline.com/doi/pdf/10.1080/10407782.2024.2343042

Reference32 articles.

1. A comprehensive review electronic cooling: A nanomaterial perspective

2. A CFD analysis of an electronics cooling enclosure for application in telecommunication systems

3. CFD analysis and experimental verification on a new type of air-cooled heat sink for reducing maximum junction temperature

4. CFD Analysis in a Liquid-Cooled Carbon Nanotube Based Micro-channel Heatsink for Electronic Cooling

5. CFD analysis of employing a novel ecofriendly nanofluid in a miniature pin fin heat sink for cooling of electronic components: Effect of different configurations

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Numerical optimization of hydrothermal and thermodynamical performance for metal foam multi-jet impingement cooling;Numerical Heat Transfer, Part A: Applications;2024-06-25

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