Heat transfer correlations for PCM-based heat sinks with plate fins

Author:

Saha S.K.,Dutta P.

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Energy Engineering and Power Technology

Reference14 articles.

1. Research and Development Study on Thermal Control by Use of Fusible Materials;Bentilla,1966

2. S. Witzman, A. Shitzer, Y. Zvirin, Simplified calculation procedure of a latent heat reservoir for stabilizing the temperature of electronic devices, in: S. Oktay et al., (Ed.), Proceedings, The Winter Annual Meeting of the ASME, Boston, MA, HTD, 1983, pp. 29–34.

3. Heat dissipation in micro-electronic systems using phase change materials with natural convection;Chebi;Chem. Eng. Comm.,1988

4. Application of phase change materials to thermal control of electronics modules: a computational study, transactions of the ASME;Pal;J. Electron. Packag.,1997

5. Inward Solid-Liquid Phase Change Heat Transfer in a Rectangular Cavity with Conducting Vertical Wall;Ho;Int. J. Heat Mass Transf,1984

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