HEAT DISSIPATION IN MICROELECTRONIC SYSTEMS USING PHASE CHANGE MATERIALS WITH NATURAL CONVECTION-Reference-Cited by-同舟云学术

HEAT DISSIPATION IN MICROELECTRONIC SYSTEMS USING PHASE CHANGE MATERIALS WITH NATURAL CONVECTION

Published:1988-07 Issue:1 Volume:69 Page:1-12
ISSN:0098-6445
Container-title:Chemical Engineering Communications
language:en
Short-container-title:Chemical Engineering Communications

Author:

CHEBI ROBERT¹,RICE PHILIP A.¹,SCHWARZ JAMES A.¹

Affiliation:

1. a Department of Chemical Engineering and Materials Science , Syracuse University , Syracuse, New York, 13244

Publisher

Informa UK Limited

Subject

General Chemical Engineering,General Chemistry

Link

https://www.tandfonline.com/doi/pdf/10.1080/00986448808940600

Reference9 articles.

1. Sze , S.M. , VLSI Technology, McGraw-Hill , 1984 .

2. Mahalingam , L.M. , and Reed , D.J. “Bipolar Device Packaging-Electrical, Thermal, and Mechanical Stress Considerations” , Solid State Technology , May , 1984 .

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