A review of heat pipe technology for foldable electronic devices
Author:
Funder
Irish Research Council
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Energy Engineering and Power Technology
Reference130 articles.
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5. Patterning the condenser-side wick in ultra-thin vapor chamber heat spreaders to improve skin temperature uniformity of mobile devices;Patankar;Int. J. Heat Mass Transf.,2016
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