Funder
National Science Foundation
Cisco Systems
Subject
Industrial and Manufacturing Engineering,Energy Engineering and Power Technology
Reference71 articles.
1. International Technology Roadmap for Semiconductor 2.0 - Hetergeneous Integration,2015
2. Integrated Interconnect Technologies for 3D Nanoelectronic Systems;Bakir,2008
3. A. Bar-Cohen, Thermal management of on-chip hot spots and 3D chip stacks, in: 2009 IEEE International Conference on Microwaves, Communications, Antennas and Electronics Systems, IEEE, pp. 1–8.
4. A single phase hybrid micro heat sink using impinging micro-jet arrays and microchannels;Robinson;Appl. Therm. Eng.,2018
5. Embedded cooling with 3D manifold for vehicle power electronics application: Single-phase thermal-fluid performance;Jung;Int. J. Heat Mass Transfer,2019
Cited by
26 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献