Author:
Choi Jongmin,Jeon Jongug,Kim Yongchan
Subject
Industrial and Manufacturing Engineering,Energy Engineering and Power Technology
Reference18 articles.
1. Computer and telecommunications equipment room cooling; a review of literature;Schmidt;IEEE Transactions on Components and Packaging Technologies,2003
2. Package embedded heat exchanger for stacked multi-chip module;Lee;Sensors and Actuators A,2004
3. Integrated thermal management techniques for high power electronic devices;McGlen;Applied Thermal Engineering,2004
4. An innovative approach to the environmental system design for TLC rooms in telecom Italia;Cinato;INTELEC,1998
5. An efficient cooling system for telecommunication equipment rooms;Nakao;INTELEC,1988
Cited by
27 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献