Effect of electroplating on the thermal conductance of fin–tube interface-Reference-Cited by-同舟云学术

Effect of electroplating on the thermal conductance of fin–tube interface

Published:2006-12 Issue:17-18 Volume:26 Page:2119-2131
ISSN:1359-4311
Container-title:Applied Thermal Engineering
language:en
Short-container-title:Applied Thermal Engineering

Author:

Cheng Wui-wai,Madhusudana Chakravarti

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Energy Engineering and Power Technology

Reference31 articles.

1. Thermal contact conductance;Madhusudana,1996

2. C.V. Madhusudana, Recent research in contact heat transfer, in: 16th National Heat and Mass Transfer Conference & 5th ISHMT/ASME Heat and Mass Transfer Conference, India, 2002.

3. Effect of fin bond on heat transfer;Dart;ASHRAE Journal,1959

4. Thermal contact resistance in finned tubing;Gardner;Transactions of ASME, Journal of Heat Transfer,1960

5. P.W. Eckels, Contact conductance of mechanically expanded plate finned tube heat exchangers, ASME Paper No. 77-HT-24, August 15–17, 1977.

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