Adsorption isotherms of halogen compounds of acetic acid and alkaloids on a copper(100) plane during electrodeposition of copper from acid copper sulphate baths
Author:
Publisher
Elsevier BV
Subject
General Engineering
Reference19 articles.
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2. Einfluss grenzflächenaktiver stoffe auf die strom-spannung-kurve von kupfer
3. Effects of addition agents on the cathode polarization potential during the electrodeposition of copper
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4. Some furan's derivatives as Corrosion Inhibitors for AI in HCI solutions;Materialwissenschaft und Werkstofftechnik;1988-12
5. Determination des parametres cinetiques de l'electrodeposition du cuivre a haute densite de courant. Cas des solutions sulfuriques sans inhibiteur;Electrochimica Acta;1984-03
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