Determination des parametres cinetiques de l'electrodeposition du cuivre a haute densite de courant. Cas des solutions sulfuriques sans inhibiteur
Author:
Publisher
Elsevier BV
Subject
Electrochemistry,General Chemical Engineering
Reference25 articles.
1. Fast Rate Electrodeposition
2. Galvanostatic studies of the kinetics of deposition and dissolution in the copper + copper sulphate system
3. Copper electrocrystallization mechanism according to morphological data and impedance measurements
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