Influence of heavier impurity deposition on surface morphology development and sputtering behavior explored in multiple linear plasma devices-Reference-Cited by-同舟云学术

Influence of heavier impurity deposition on surface morphology development and sputtering behavior explored in multiple linear plasma devices

Published:2019-01 Issue: Volume:18 Page:67-71
ISSN:2352-1791
Container-title:Nuclear Materials and Energy
language:en
Short-container-title:Nuclear Materials and Energy

Author:

Nishijima D.,Kreter A.^ORCID,Baldwin M.J.,Borodin D.^ORCID,Eksaeva A.,Hwangbo D.,Kajita S.^ORCID,Miyamoto M.,Ohno N.,Patino M.,Pospieszczyk A.,Rasinski M.,Schlummer T.,Terra A.,Doerner R.P.

Funder

DOE

Publisher

Elsevier BV

Subject

Nuclear Energy and Engineering,Materials Science (miscellaneous),Nuclear and High Energy Physics

Reference17 articles.

1. Sputtering yields;Eckstein,2007

2. Impact of surface morphology on sputtering during high-fluence plasma exposure

3. Plasma-induced morphology of beryllium targets exposed in PISCES-B

4. Sputtering in a high-flux plasma environment

5. Sputtering properties of tungsten ‘fuzzy’ surfaces

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