Subject
Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry
Reference30 articles.
1. R. Winand, in: I.H. Warren (Ed.), Application Of Polarisation Measurements in The Control Of Metal Deposition, Elsevier, Amsterdam, 1984, p. 47.
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3. W.H. Safranek, in: F. Lowenheim (Ed.), Modern Electroplating, The Electrochemical Society, NJ, 1974.
4. The effect of some organic additives upon copper electrowinning from sulphate electrolytes
5. Leveling and Microstructural Effects of Additives for Copper Electrodeposition
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