Author:
Naik Mehul B.,Lakshmanan Satish K.,Wentorf R.H.,Reeves Robert R.,Gill William N.
Subject
Materials Chemistry,Inorganic Chemistry,Condensed Matter Physics
Reference24 articles.
1. Chemical Vapor Deposition of Copper for Multilevel Metallization
2. Electroless Cu for VLSI
3. P.-L. Pai, C.H. Ting, C. Chang, C.-S. Wei, D.B. Fraser, Proc. 5th Int. Conf. on Advanced Metallization for ULSI Application, MRS, Pittsburgh, 1992, p. 359.
4. Chemical vapor deposition of copper from 1,5‐cyclooctadiene copper(I) hexafluoroacetylacetonate
5. Hot-wall chemical vapor deposition of copper from copper(I) compounds. 2. Selective, low-temperature deposition of copper from copper(I) .beta.-diketonate compounds, (.beta.-diketonate)CuLn, via thermally induced disproportionation reactions
Cited by
7 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献