Requirements for Ductile-mode Machining Based on Deformation Analysis of Mono-crystalline Silicon by Molecular Dynamics Simulation
Author:
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering
Reference8 articles.
1. Brittle-Ductile Transition Phenomena in Microindentation and Micromachining;Shimada;Annals of the CIRP,1995
2. Feasibility Study on Ultimate Accuracy in Microcutting Using Molecular Dynamics Simulation;Shimada;Annals of the CIRP,1993
3. Modeling solid-state chemistry: Interatomic potentials for multicomponent systems;Tersoff;Physical Review B,1989
4. On the Mechanics and Physics in the Nano-Indentation of Silicon Monocrystals;Zhang;JSME Series A.,1999
5. Introduction to Solid State Physics;Kittel,1996
Cited by 76 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Comprehensive study of material removal mechanism of polycrystalline copper during ultra-precision cutting using molecular dynamics;Precision Engineering;2024-03
2. Study on the transformation and control mechanism of amorphous damage during the grinding process of monocrystalline silicon considering grain shapes by MD method;Tribology International;2023-09
3. Molecular Dynamics Simulation of Ti Metal Cutting Using a TiN:Ag Self-Lubricating Coated Tool;Materials;2023-02-05
4. Fundamental insights of mechanical polishing on polycrystalline Cu through molecular dynamics simulations;Materials Today Communications;2022-08
5. Material properties and machining characteristics under high strain rate in ultra-precision and ultra-high-speed machining process: a review;The International Journal of Advanced Manufacturing Technology;2022-04-27
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3