Author:
Rakesh Banothu,Prasad Dumpa,Kumari Ch. Usha,Vighnesh N. Arun,Suresh M.,Panigrahy Asisa Kumar
Reference14 articles.
1. P. Garrou, C. Bower, P. Ramm, Handbook of 3D Integration: Technology and Applications of 3D Integrated.
2. C.S. Tan, R.J. Gutmann, L.R. Reif, Wafer level 3-D ICs process technology, Springer Science & Business Media, 3, 2009.
3. Three-dimensional integrated circuits and the future of system-on-chip designs;Patti;Proc. IEEE,2006
4. Bridging the processor-memory performance gap with 3D IC technology;Liu;IEEE Design Test Comp.,2005
5. Three-dimensional IC trends;Akasaka;Proc. IEEE,1986
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