Performance evaluation of noise coupling on Germanium based TSV filled material for future IC integration technique-Reference-Cited by-同舟云学术

Performance evaluation of noise coupling on Germanium based TSV filled material for future IC integration technique

Published:2021 Issue: Volume:45 Page:1494-1497
ISSN:2214-7853
Container-title:Materials Today: Proceedings
language:en
Short-container-title:Materials Today: Proceedings

Author:

Navaneetha Alluri,Kishore Reddy A.,Aruna Deepthi S.,Usha Kumari Ch.,Kumar Poola Praveen,Arunkumar Gudivada A.,Durga Prakash Matta,Kumar Panigrahy Asisa

Publisher

Elsevier BV

Subject

General Medicine

Reference22 articles.

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4. Bridging the processor-memory performance gap with 3D IC technology;Liu;IEEE Des. Test Comput.,2005

5. Three-dimensional IC trends;Akasaka;Proc. IEEE,1986

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