1. Electrodeposition of multilayer NiMn beams for probes
2. Adhesion of Electrodeposited Copper, Nickel and Silver Films on Copper, Nickel and Silver Substrates
3. Alyssa A. Frey, Nicholas R. Wozniak, Timothy B. Nagi, Matthew P. Keller, J. Mark Lunderberg, Graham F. Peaslee, Paul A. DeYoung, Jennifer R. Hampton, Int. J. Electrochem. (2011) ID 604395.
4. Electrodeposition of nanostructured Ni(1−x)Mnx alloys films from chloride bath