Adhesion of Electrodeposited Copper, Nickel and Silver Films on Copper, Nickel and Silver Substrates
Author:
Affiliation:
1. Department of Applied Chemistry, Graduate School of Engineering, Tokyo Metropolitan University
2. Department of Chemistry and Material Engineering, Faculty of Engineering, ShinShu University
Publisher
Japan Institute of Metals
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
https://www.jstage.jst.go.jp/article/matertrans/45/12/45_12_3330/_pdf
Reference6 articles.
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2. 2) G.A. Prentice and K.S. Chen: J. Applied Electrochem. 28 (1998) 971.
3. 3) C.J. Chen and K.L. Lin: Thin Solid Films 370 (2000) 106.
4. 4) M. Schlesinger and M. Paunovic: Modern Electroplating, (John Wiley & Sons, Inc., 2000) pp.61-65.
5. 5) T. Watanabe and Y. Tanabe: J. Metal. Finish. Soc. Jpn. 25 (1974) 35-41.
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