Investigations on the properties of new lead free solder alloy composition – Sn-0.5Cu-3.5Bi-Reference-Cited by-同舟云学术

Investigations on the properties of new lead free solder alloy composition – Sn-0.5Cu-3.5Bi

Published:2020 Issue: Volume:21 Page:329-331
ISSN:2214-7853
Container-title:Materials Today: Proceedings
language:en
Short-container-title:Materials Today: Proceedings

Author:

Jayesh S.,Elias Jacob

Publisher

Elsevier BV

Subject

General Medicine

Reference13 articles.

1. NCMS Lead-Free Solder Project Final Report, NCMS, National Center for Manufacturing Sciences, 3025 Boardwalk, Ann Arbor, Michigan 48108-3266, Report 0401RE96, August 1997.

2. Schwartz, Soldering: Understanding the basics;Mel,2014

3. Fundamental properties of Pb-free solder alloys;Handwerker,2007

4. Dissolution kinetics of BGA Sn-Pb and Sn-Ag solder with Cu substrate during reflow;Sharif;Mater. Sci. Eng.,2004

5. New Sn-0.7Cu-based solder alloys with minor alloying additions of Pd, Cr and Ca;Koo;J. Alloys Compd.,2014

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