Optimization of parameters and fabrication of micro channel heat sinks using micro scanning EDM and grey relational analysis
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Published:2021
Issue:
Volume:45
Page:3499-3505
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ISSN:2214-7853
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Container-title:Materials Today: Proceedings
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language:en
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Short-container-title:Materials Today: Proceedings
Author:
Sai Suhruth Teja Kaja
Reference15 articles.
1. High-performance heat sinking for VLSI;Tuckerman;IEEE Electron Device Lett.,1981
2. R.W. Knight, J.S. Goodling, D.J. Hall, Optimal thermal design of forced convection heat sinks––Analytical, ASME J. Electron. Packaging 113 (1991) 313–321
3. High power density air-cooled microchannel heat exchanger;Kwon;International Journal of Heat and Mass Transfer,2018
4. Active heat sink with piezoelectric translational agitators, piezoelectric synthetic jets, and micro pin fin arrays;Yeom;Experimental Thermal and Fluid Science,2018
5. Fabrication of copper-based microchannel devices and analysis of their flow and heat transfer characteristics;Mei;J. Micromech. Microeng.,2009
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