Fabrication of copper-based microchannel devices and analysis of their flow and heat transfer characteristics-Reference-Cited by-同舟云学术

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Fabrication of copper-based microchannel devices and analysis of their flow and heat transfer characteristics

Published:2009-02-05 Issue:3 Volume:19 Page:035009
ISSN:0960-1317
Container-title:Journal of Micromechanics and Microengineering
language:
Short-container-title:J. Micromech. Microeng.

Author:

Mei Fanghua,Phillips W A,Lu B,Meng W J,Guo S

Publisher

IOP Publishing

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Reference26 articles.

1. High-performance heat sinking for VLSI

2. Development of Micro Channel Heat Exchanging

3. An experimental investigation of microchannel flow with internal pressure measurements

4. Experimental microchannel heat sink performance studies using nanofluids

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