A sensitivity study of material properties for coupled convective-conductive heat transfer generated in an electronic equipment

Author:

Wang H.Y.,Saulnier J.B.

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Reference11 articles.

1. Cooling electronic components: forced convection experiments with an air-cooled array;Moffat;Heat Transfer In Electronic Equipment,1985

2. Buoyancy induced convection in a non-uniformly heated array of cubical elements on a vertical channel wall;Ortega;Heat Transfer In Electronic Equipment,1986

3. Natural convection air cooling of heated components mounted on a vertical wall;Afrid;Numer. Heat Transfer, Part A,1989

4. Laminar mixed convection in a partially blocked, vertical channel;Habchi;Int. J. Heat Mass Transfer,1986

5. A generalization of the additive correction methods for the iterative solution of matrix equations;Settari;SIAM J. Numer. Anal.,1973

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