Comprehensive examination of topologically optimized thermo-fluid heat sinks-Reference-Cited by-同舟云学术

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Comprehensive examination of topologically optimized thermo-fluid heat sinks

Published:2024-07 Issue: Volume:298 Page:131364
ISSN:0360-5442
Container-title:Energy
language:en
Short-container-title:Energy

Author:

Waelveerakup Sorravit,Thanomthong Kasidith,Tantivimonkajorn Punnapop,Wanittansirichok Vichapol,Mongkholphan Kanich,Sakamatapan Kittipong,Promoppatum Patcharapit^ORCID,Wongwises Somchai

Publisher

Elsevier BV

Reference58 articles.

1. Multifunctional thermal management materials with excellent heat dissipation and generation capability for future electronics;Feng;ACS Appl Mater Interfaces,2019

2. Thermal management and temperature uniformity enhancement of electronic devices by micro heat sinks: a review;He;Energy,2021

3. Design and testing of topology optimized heat sinks for a tablet;Martínez-Maradiaga;Int J Heat Mass Transfer,2019

4. A thermal management strategy for electronic devices based on moisture sorption-desorption processes;Wang;Joule,2020

5. Topology optimized novel additively manufactured heat sink: experiments and numerical simulations;Ning;Energy Convers Manag,2023

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