Study on the curing process and shearing tests of die attachment by Ag-epoxy electrically conductive adhesive-Reference-Cited by-同舟云学术

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Study on the curing process and shearing tests of die attachment by Ag-epoxy electrically conductive adhesive

Published:2010-03 Issue:2 Volume:30 Page:80-88
ISSN:0143-7496
Container-title:International Journal of Adhesion and Adhesives
language:en
Short-container-title:International Journal of Adhesion and Adhesives

Author:

Guan Youliang,Chen Xu,Li Fengqin,Gao Hong

Publisher

Elsevier BV

Subject

Polymers and Plastics,General Chemical Engineering,Biomaterials

Reference34 articles.

1. Solders and soldering materials, design, production and analysis for reliable bonding;Manko,1979

2. Soldering in electronics;Wassink,1984

3. Handbook of microelectronics packaging and interconnection technologies;Sinnadurai,1985

4. RoHS Regulations (UK) Government Guidance Notes, August 2005.

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