Author:
Rao Yang,Lu Daoqiang,Wong C.P.
Subject
Polymers and Plastics,General Chemical Engineering,Biomaterials
Reference13 articles.
1. Alpert BT, Schoenberg AJ. Conductive adhesives as a soldering alternative. Electron Packag Prod 1991; 130–2.
2. Nguyen G, Williams J, Gibson F, Winster T. Electrical reliability of conductive adhesives for surface mount applications. Proceedings of International Electronic Packaging Conference, 1993. p. 479–86.
3. Zwolinski M, Hickman J, Rubon H, Zaks Y. Electrically conductive adhesives for surface mount solder replacement. Proceedings of the Second International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Stockholm, Sweden; June 3–5, 1996. p. 333–40.
4. Smith-Vargo L. Adhesives that posses a science all their own. Electron Packag Prod 1986; 48–9.
Cited by
43 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献