Publisher
Springer Science and Business Media LLC
Subject
General Physics and Astronomy,Mechanics of Materials,General Materials Science
Reference37 articles.
1. Namitha, L.K., Sebastian, M.T.: Fused silica filled silicone rubber composites for flexible electronic applications. Mater. Sci. Forum 830–831, 537–540 (2015)
2. Xiao, J., Chung, D.D.L.: Thermal and Mechanical stability of electrically conductive adhesive joints. J. Electron. Mater. 34(5), 625–629 (2005)
3. Pander, M., Schulze, S., Ebert, M.: Mechanical modelling of electrically conductive adhesives for photovoltaic applications. In: 29th European Photovoltaic Solar Energy Conference and Exhibition, pp. 3399–3405 (2014)
4. Andrae, A.S.G., Itsubo, N., Yamaguchi, H., Inaba, A.: Conductive adhesives vs solder paste: a comparative life cycle based screening. In: Takata, S., Umeda, Y. (eds.) Advances in Life Cycle Engineering for Sustainable Manufacturing Businesses, pp. 285–290. Springer, London (2007)
5. Jagt, J.C.: Reliability of electrically conductive adhesive joints for surface mount applications: a summary of the state of the art. IEEE Trans. Compon. Packag. Manuf. Technol. Part A: 21(2), 215–225 (1998)
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献