Impedance analysis for condition monitoring of single lap CNT-epoxy adhesive joint-Reference-Cited by-同舟云学术

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Impedance analysis for condition monitoring of single lap CNT-epoxy adhesive joint

Published:2019-01 Issue: Volume:88 Page:59-65
ISSN:0143-7496
Container-title:International Journal of Adhesion and Adhesives
language:en
Short-container-title:International Journal of Adhesion and Adhesives

Author:

Sam-Daliri Omid,Faller Lisa-Marie,Farahani Mohammadreza,Roshanghias Ali,Araee Alireza,Baniassadi Majid,Oberlercher Hannes,Zangl Hubert

Funder

Alpen-Adria-Universität

Publisher

Elsevier BV

Subject

Polymers and Plastics,General Chemical Engineering,Biomaterials

Reference19 articles.

1. Neutron imaging as a tool for the non-destructive evaluation of adhesive joints in aluminium;Michaloudaki;Int J Adhes Adhes,2005

2. Ultrasonic guided wave inspection of adhesive bonds between composite laminates;Ren;Int J Adhes Adhes,2013

3. Ultrasonic analysis and lock-in thermography for debonding evaluation of composite adhesive joints;Palumbo;NDT E Int,2016

4. Adhesive defect density estimation applying the acoustic emission technique;Croccolo;Int J Adhes Adhes,2009

5. Defect types and non-destructive testing techniques for composites and bonded joints;Cawley;Mater Sci Technol,1989

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