Chemical modification techniques of corn starch for synthesis wood adhesive
Author:
Publisher
Elsevier BV
Subject
Polymers and Plastics,General Chemical Engineering,Biomaterials
Reference87 articles.
1. Preparation and characterizations of a chitosan-based medium-density fiberboard adhesive with high bonding strength and water resistance;Ji;Carbohydr Polym,2017
2. “Greener” adhesives composed of urea-formaldehyde resin and cottonseed meal for wood-based composites;Liu;J Clean Prod,2018
3. Influence of glyoxal on curing of urea-formaldehyde resins;Perminova;Int J Adhesion Adhes,2019
4. Demonstration of co-polymerization in melamine-urea-formaldehyde reactions using 15N NMR correlation spectroscopy;Philbrook;Polymer (Guildf),2005
5. Environment-friendly adhesives for surface bonding of wood-based flooring using natural tannin to reduce formaldehyde and TVOC emission;Kim;Bioresour Technol,2009
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