Environment-friendly adhesives for surface bonding of wood-based flooring using natural tannin to reduce formaldehyde and TVOC emission

Author:

Kim Sumin

Publisher

Elsevier BV

Subject

Waste Management and Disposal,Renewable Energy, Sustainability and the Environment,General Medicine,Environmental Engineering,Bioengineering

Reference26 articles.

1. Occurring of volatile organic compounds in indoor air;Brown,1999

2. Natural adhesive-bonded particleboards;Fuwape;Bioresource Technology,1994

3. Japanese Standards Association, 2001. Building boards determination of formaldehyde emission – desicator method. JIS A 1460:2001.

4. Curing behavior and viscoelastic properties of pine and wattle tannin-based adhesives studied by dynamic mechanical thermal analysis and FT-IR-ATR spectroscopy;Kim;Journal of Adhesion Science and Technology,2003

5. Evaluation of formaldehyde emission of pine and wattle tannin-based adhesives by gas chromatography;Kim;Holz als Roh- und Werkstoff,2004

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