An intelligent system for wafer bin map defect diagnosis: An empirical study for semiconductor manufacturing-Reference-Cited by-同舟云学术

An intelligent system for wafer bin map defect diagnosis: An empirical study for semiconductor manufacturing

Published:2013-05 Issue:5-6 Volume:26 Page:1479-1486
ISSN:0952-1976
Container-title:Engineering Applications of Artificial Intelligence
language:en
Short-container-title:Engineering Applications of Artificial Intelligence

Author:

Liu Chiao-Wen,Chien Chen-Fu

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Artificial Intelligence,Control and Systems Engineering

Reference34 articles.

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