In-situ ultra-high vacuum studies of electromigration in copper films
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials
Reference24 articles.
1. Analysis of stress‐induced void growth mechanisms in passivated interconnect lines
2. Microstructure based statistical model of electromigration damage in confined line metallizations in the presence of thermally induced stresses
3. DIRECT TRANSMISSION ELECTRON MICROSCOPE OBSERVATION OF ELECTROTRANSPORT IN ALUMINUM THIN FILMS
4. Thin Films: Interdiffusion and Reactions;d'Heurle,1978
5. In SituObservation of Electromigration in Cu Film Using Scanning µ-Reflection High-Energy Electron Diffraction Microscope
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