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Manufacturing aspects of low pressure chemical-vapor-deposited TiN barrier layers

  • Published:1993-12 Issue:1-2 Volume:236 Page:325-329
  • ISSN:0040-6090
  • Container-title:Thin Solid Films
  • language:en
  • Short-container-title:Thin Solid Films

Author:

Travis E.O.,Fiordalice R.W.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference19 articles.

1. A scalable submicron contact technology using conformal LPCVD TiN;Travis,1990

2. Diffusion barrier properties of Ti/TiN investigated by transmission electron microscopy;Mandle;J. Appl. Phys.,1990

3. An integrated CVD TiN barrier and self-aligned tungsten plug contact technology for high aspect ratio submicron contacts;Travis,1991

4. Thin film properties of LPCVD TiN barrier for silicon device technology;Hegde,1992

5. A manufacturable, integrated contact fill technology based on collimated PVD-Ti, low temperature MOCVD-TiN and CVD-W;Raaijmakers,1992

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