Corrosion of solder-coated TiPdAu thin film conductors in a moist chlorine atmosphere-Reference-Cited by-同舟云学术

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Corrosion of solder-coated TiPdAu thin film conductors in a moist chlorine atmosphere

Published:1977-05 Issue:1-2 Volume:43 Page:189-213
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Fuss F.N.,Hartwig C.T.,Morabito J.M.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference26 articles.

1. The interaction of some atmospheric gases with a tin-lead alloy;Tompkins;J. Electrochem. Soc.,1973

2. Solders and Soldering;Manko,1964

3. Thin Film Technology;Berry,1968

4. Termination materials for thin film resistors;Fisher,1971

5. Dissolution of gold, silver, palladium, platinum, copper and nickel in a molten tin-lead solder;Bader;Weld. J. Res.,1969

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Review of Corrosion Failure Mechanisms during Accelerated Tests: Electrolytic Metal Migration;Journal of The Electrochemical Society;1987-01-01

2. An Improved Accelerated Test Chamber for Electrolytic Metal Migration and Corrosion;Journal of The Electrochemical Society;1985-11-01

3. Metal Migrations Outside the Package During Accelerated Life Tests;IEEE Transactions on Components, Hybrids, and Manufacturing Technology;1982-12

4. Ambient-induced diffusion in metal film/halide systems;Thin Solid Films;1982-11

5. Recent advances in solder bond technology for microelectronic packaging;Thin Solid Films;1980-10

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