Atomic interdiffusion in Au/amorphous NiNb/ semiconductor systems-Reference-Cited by-同舟云学术

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Atomic interdiffusion in Au/amorphous NiNb/ semiconductor systems

Published:1983-06 Issue:1-2 Volume:104 Page:69-79
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Doyle B.L.,Peercy P.S.,Thomas R.E.,Perepezko J.H.,Wiley J.D.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference20 articles.

1. Proc. Conf. on High Temperature Electronics,1981

2. Proc. High Temperature Electronics and Instrumentation Conf.,1982

3. Proc. Conf. on High Temperature Electronics;Sanders,1981

4. Proc. Conf. on High Temperature Electronics;Jurgens,1981

5. Proc. High Temperature Electronics and Instrumentation Conf.;Zipperian,1982

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4. ZrAl3Intermetallic Compound Thin Film as a Diffusion Barrier between Al and Au Layers;Japanese Journal of Applied Physics;1994-06-15

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