Mechanical stresses in low pressure chemically vapour deposited silicon films-Reference-Cited by-同舟云学术

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Mechanical stresses in low pressure chemically vapour deposited silicon films

Published:1988-11 Issue:1 Volume:165 Page:181-191
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Koleshko V.M.,Belitsky V.F.,Kiryushin I.V.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference15 articles.

1. Polycrystalline Semiconductor Films in Microelectronics;Koleshko,1978

2. Inspection in Microelectronics Technology;Koleshko,1979

3. Mechanism of Formation and Substructure of Condensed Films;Palatnik,1972

Cited by 14 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. In situ transmission electron microscopy observations of the crystallization of amorphous Ge films;Applied Physics A;2008-08-01

2. Internal stress in Cat-CVD microcrystalline Si:H thin films;Thin Solid Films;2006-04

3. Oxygen Effect on Laser Crystallization of Sputtered a-Si Film on Plastic Substrate;Japanese Journal of Applied Physics;2006-01-13

4. A new technique for producing large-area as-deposited zero-stress LPCVD polysilicon films: the MultiPoly process;Journal of Microelectromechanical Systems;2000-12

5. Residual Stress of Silicon Films Deposited by Lpcvd From Silane;MRS Proceedings;1998

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