Observation of a marker shift in a Cu-Sn thin film diffusion couple by Auger electron spectroscopy methods-Reference-Cited by-同舟云学术

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Observation of a marker shift in a Cu-Sn thin film diffusion couple by Auger electron spectroscopy methods

Published:1981-11 Issue:1 Volume:86 Page:43-47
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Chopra R.,Ohring M.,Oswald R.S.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference17 articles.

1. Thin Films Interdiffusion and Reactions;Rosenberg,1978

2. Korozja Gazowa Metali.;Mrowec,1975

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1. Morphological and Mechanical Behaviour of Cu–Sn Alloys—A review;Metals and Materials International;2021-01-11

2. Reactions in Electrodeposited Cu/Sn and Cu/Ni/Sn Nanoscale Multilayers for Interconnects;Materials;2016-05-31

3. Intermetallic Layer Growth Kinetics in Sn-Ag-Cu System using Diffusion Multiple and Reflow Techniques;Advanced Engineering Materials;2014-07-22

4. Enhanced diffusion caused by surface reactions in thin films of Sn–Cu–Mn;Thin Solid Films;2014-01

5. An isochronal kinetic study of intermetallic compound growth in Sn/Cu thin film couples;Thin Solid Films;2006-12

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