Subject
Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials
Reference30 articles.
1. Properties of die bond alloys relating to thermal fatigue;Olsen;IEEE Trans. Compon. Hybrids, Manuf. Technol.,1979
2. AES/ESCA/SEM/EDX studies of die bond materials and interfaces;Li,1984
3. A critical review of VLSI die attachment in high reliability application;Shukla;Solid State Technol.,1985
4. Die bond material and bonding mechanisms in microelectronic packaging;Selvaduray;Thin Solid Films,1987
5. Phase diagrams of binary gold alloys,1987
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