The structure and topographical modification of surfaces during depth profiling
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials
Reference17 articles.
1. Use of Auger Electron Spectroscopy and Inert Gas Sputtering for Obtaining Chemical Profiles
2. Secondary−ion mass spectrometry and its use in depth profiling
3. Crater‐edge profiling in interface analysis employing ion‐beam etching and AES
4. Depth resolution in sputter profiling
5. A cratering analysis for quantitative depth profiling by ion beam sputtering
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2. Examination and Assessment of CVD Coated PM High Speed Steel Cutting Tools;Powder Metallurgy;1988-01
3. Sputter Depth Profiling of Microelectronic Structures;Journal of The Electrochemical Society;1983-05-01
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